摘要
在微机械加工中,硅的各向异性腐蚀是关键技术之一.特别在当今微机械加工向微型化、多功能化及智能化发展之际,更需利用硅的各向异性腐蚀来制备三维结构.对于单晶硅材料,主要腐蚀剂如表1所示.
This Paper describes the application of anisotropic etching of silicon to the PH-sensors . The description is focused on the etching mechanism, etching rate versus solution concentration and temperature of silicon using the KOH solution, back etching techmique, Si3N4 and glass double protection, with which the sensor reliability has been raised.
出处
《电子器件》
CAS
1991年第3期39-42,共4页
Chinese Journal of Electron Devices