摘要
利用红外热像仪,对某公司大功率LED路灯的灯壳、环路热管及芯片的温度进行了测量,其中灯壳和环路热管表面温度分布较均匀,平均温度分别约为40℃和43℃;芯片表面的最高温度达67.5℃。采用ICEPAK热分析软件建立了该灯环路热管散热模组的模型并对其进行了热分析,将模拟结果与实际测量结果进行了对比,发现两者趋于一致。
Using infrared camera, the temperatures of lamp housing, loop heat pipe and chip of the high power LED street lamp in a company are measured in this paper, of which the temperature distribution on the surface of the lamp housing and loop heat pipe is uniform, and the average temperatures of them are about 40℃and 43℃; while the maximum temperature of the chip reaches 67.5℃. The thermal analysis software ICEPAK is used to build and analyze the thermal condition of the cooling modular of the loop heat pipe in the street lamp. By comparison, the actual measured results are close to the simulation results.
出处
《建筑热能通风空调》
2013年第4期34-36,33,共4页
Building Energy & Environment
基金
十二五"国家科技支撑计划课题(2011BAJ03B07)