摘要
采用 DMA,TBA和动态粘弹谱仪等试验手段研究了聚砜增韧环氧 -双氰双胺共混体系的粘弹性 ,实验中用斜削双悬臂梁 ( TDCB)试样测定共混体系断裂韧性 GIC,并阐述两者的相互关系 ,试验结果表明 :环氧 /聚砜体系形成的韧性聚砜连续相以网膜包覆环氧固化球粒的“网膜 -球粒”结构 ,是使体系具有特殊的粘弹性特征的原因 。
Testing methods such as DMA, TBA and dynamic viscoelastometer were utilized to study the viscoelasticity of epoxy dicyandiamide blend toughened by polysulfone. TDCB samples were used to find out the value of G IC of the blend systems. Consequently, the relationship between G IC and viscoelasticity was clarified. The results verified that, in epoxy/polysulfone blends, the ductile polysulfone, as a continuous phase, covered cured epoxy particles and a 'network film particles' structure was produced, which gave the blend system viscoelasticity and finally achieved toughness and good comprehensive properties.
出处
《航空学报》
EI
CAS
CSCD
北大核心
2000年第C00期103-105,共3页
Acta Aeronautica et Astronautica Sinica
关键词
复合材料
树脂基体
粘弹性
增韧
composites
resin matrix
viscoelasticity
toughening
