摘要
对于半加成法(SAP)制作精细线路,铜箔表面粗化处理效果直接影响其制作能力和产品良率。本文通过表面粗糙度测量、SEM分析和贴膜效果观察,分别对火山灰粗化、化学药水微蚀、喷砂等几种前处理方式的处理效果进行评估,并确定制作精细线的最佳前处理方式。
For the fine line made by semi-additive process（SAP）, the copper foil surface roughening pretreatment will directly affect the production capacity and product yield. In this paper, the ash pretreatment, chemical pretreatment and pumice pretreatment are evaluated, and the ideal pretreatment by roughness value, SEM, and the dry film lamination effect are determined.
出处
《印制电路信息》
2013年第9期24-26,共3页
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