盲铣板技术研究

Blind Gong board technology research

随着电子产品逐渐向功能化、集成化、微小化的发展,印制电路板制作技术难度也越来越高,因此要求印制线路板的设计更加多样化;盲铣板的技术研究是根据客户设计要求来的,目前越来越多的客户关注和应用盲铣板。本文主要对盲铣板的盲铣深度公差、盲铣槽平滑度、盲铣槽外形尺寸进行分析和研究,并对各自的制程能力进行了制定,为大批量导入盲铣板提供了技术支持和储备。

Along with the electronic products migration gradually to the development multi-function, integration, miniaturization, printed circuit board production technology difficulty is becoming more and more high, So the printed circuit board design is more diversified; Blind gong plate technology research is designed according to customer requirements. At present more and more customers focus on blind gong board and application. This paper mainly discusses on the depth of blind gong plate tolerance smoothness, blind gong groove, Gong groove shape dimension analysis and research, and the respective process capability. It provides bulk import blind gong board technical support and experiment.