摘要
PCBA分板包括装配前分板和装配后分板,前者只有在进行回流焊后需要进行小单元局部的选择性波峰焊时才应用得到,而后者较为普遍。根据装配拼板的小单元之间连接设计的不同,PCBA分板可以分为V槽分板、吊点分板、邮票孔分板等方法。PCBA分板过程如若处理不当,一些非PCB缺陷不良的开短路也会随之而生。本文通过分析一些PCBA分板不良所导致的开短路失效范例供借鉴,以及提出优化的分板方式,目的是提高PCBA分板质量和避免不必要的品质纠纷与经济损失。
De-panelizing may be adopted before or after assembly. De-panelizing after assembly is extensively adopted. De-panelizing before assembly is only adopted for optional wave-soldering. De-panelizing may be processed in different ways according to panelizing design, such as V-cut, hanging point or stamp hole. Open/short circuit may occur with improper de-panelizing. By analyzing failure mode of open/circuit caused by improper de-panelizing, this article proposes optimizing solution for proper de-panelizing, in order to improve de- panelizing quality, preventing quality disputes or economic losses.
出处
《印制电路信息》
2013年第9期64-70,共7页
Printed Circuit Information
关键词
分板
开路
短路
De-Panelizing
Open Circuit
Short Circuit
