摘要
以N,N,N′,N′-四炔丙基-4,4′-二氨基二苯甲烷(TPDDM)、4,4′-联苯二苄叠氮(BAMBP)和二乙炔基苯(DEB)为单体原料,以1,3-偶极环加成反应进行三元共聚,制备出共聚型三唑树脂(C-PTA树脂)。研究了单体配比及不同结构DEB对C-PTA树脂耐热性能的影响。结果表明:BAMBP、TPDDM、DEB的最优摩尔配比为1∶0.7∶0.7,此配比下C-PTA树脂固化物的玻璃化转变温度(Tg)为265℃,在空气和氮气气氛中的5%热失重温度Td5分别为329℃和340℃。当参与共聚反应的DEB全为间位结构时,C-PTA树脂的Tg最高。
Using N,N,N',N' -tetrapropargyl-diamino diphenyl methane(TPDDM), 1,1'-bezidomethyl-4,4'-biphe- nyl(BAMBP) and diethynylbenzene(DEB) as raw materials, a copolytriazole resin(C-PTA resin) was pre- pared via 1,3-dipolar cycloaddition reaction. The effects of molar ratio of monomers and different DEB structure on the heat-resistance of the C-PTA resin were studied. The results show that the best molar ra- tio of BAMBP, TPDDM and DEB is 1:0.7: 0.7, under the ratio, the glass transition temperature(Tg) of the C-PTA resin is 265 ℃, and the 5% weight loss temperature is 329 ℃ and 340 ℃ at air and nitrogen atmosphere respectively. When the DEB structure is meta position structure, the Tg of the C-PTA resin is the highest.
出处
《绝缘材料》
CAS
北大核心
2013年第4期1-4,共4页
Insulating Materials
基金
上海市重点学科资助(项目编号:B502)
关键词
聚三唑树脂
玻璃化转变温度
固化
polytriazole resin
glass transition temperature
curing