LED芯片粗精定位系统

LED chips coarse and fine locating system

LED芯片定位是进行芯片检测、划片、扩晶、固晶及判断芯片电气特性、芯片管脚是否达到要求,能否成功分选LED芯片质量的关键一环。针对这一问题,提出了采用先粗后精的定位方法。首先运用低倍率大视野进行LED芯片的模板匹配粗定位;然后在粗定位生成坐标的基础上,在其坐标的八领域内进行高倍率小视野模板匹配的高精度定位,这样既实现了定位的快速性也解决了定位的准确性。实验结果表明,其图像定位误差小于1μm,滑台定位误差4μm,LED芯片粗精定位系统的定位误差小于5μm,定位速度大于5粒/s,为检测机、分拣机、固晶机等设备的芯片级高精度定位系统开辟了新的方法。

LED chips locating is a key link in chips detection, dicing, wafer expansion, die bond and in telling whether the electrical characteristics of the chips and the chips pin can meet the requirements and in telling whether it can sort the LED chips quality successfully. To solve this problem, the coarse-to-fine locating method was put forward. Firstly, the low magnification and high coverage were used to conduct the coarse locating of LED chips＇ template matching. Then, based on the generated coordinates of coarse positioning, the high-precision locating of high magnification and low coverage template matching within the eight fields of the coordinates were conducted. In this way it could solve not only the fastness but also the precision of the positioning. The results of the experiment show that the image locating precision error is less than 1 μm; the moving table locating precision error is 4 μm; overall locating system locating precision is less than 5 μm; locating speed is greater than 5 grains/second, thus providing a new way for chips high-precision locating system of equipment such as detection machines, sorters and die bonders.