电子封装用金属基复合材料的研究进展

Research Progress on Metal Matrix Composites for Electronic Packaging

随着电子器件功率的不断增大以及芯片集成度的不断提高,器件的散热已成为制约其发展的关键因素。主要对承担散热任务的封装材料的发展进行了综述,重点是针对近几年为满足大功率微波器件的散热要求而开发的金属基复合材料的发展及制备方法进行了介绍,最后对性能优异的金刚石-Cu材料目前国内存在的问题及未来的研究方向进行了展望。

With the increasing power of electronic devices as well as the continuous improvement of chip integration, devices cooling has become a key factor of restricting its development. The develop- ment of packaging materials undertaking the task of cooling were reviewed in this paper, and espe- cially, the metal matrix composite materials developed to meet the thermal requirements of high-pow- er microwave devices as well as their preparation methods were introduced. In the end, current do- mestic problems of high-performance diamond-Cu material and future research directions are dis- cussed.