溶液特性对电子焊料合金及接头中Sn浸出的影响

Leaching behavior of Sn from electronic solders and their joints in solutions with different pH

选用Sn-9Zn、Sn-3.5Ag-0.5Cu、Sn-37Pb焊料合金及钎焊接头,研究它们在典型模拟溶液中浸出30 d后Sn的浸出行为,以分析电子垃圾的掩埋对土壤污染情况.结果表明,Sn-3.5Ag-0.5Cu接头在盐溶液中Sn的浸出量是最高的,对环境的污染最为严重,而在酸和碱溶液中浸出量最少,对环境的污染较轻;Sn-9Zn和Sn-37Pb焊料合金和接头在3种模拟溶液中均有Sn浸出,对环境均会造成不同程度的污染.

The leaching behavior of tin from Sn-9Zn, Sn-3.5Ag-0.5Cu, Sn-37Pb solder alloys,and their joints was investigated in simulated soil solutions with different pH. The 30 days＇ leaching experiment was conducted to analyze the polluted soils where E-wastes have been buried. The leached amount of Sn from Sn-3.5Ag-0.5Cu joint treated in salt solution was higher than the joint immersed in alkaline and acid solutions. Moreover, different amount of Sn was found revealed after Sn-9Zn and Sn-37Pb alloys and their joints were immersed in the three different solutions.