摘要
铜铝双金属复合材料由于其优良的综合性能受到广泛关注和研究。介绍了铜铝双金属复合材料的发展概况,综述了复合技术、界面行为、金属间化合物的形成和生长规律、金属间化合物的微观结构以及铜铝间的扩散行为等方面内容,论述了铜铝复合材料的力学和电学性能的研究进展,并提出了其发展趋势。
Copper/aluminum bimetal composite is being intensively studied because of its excellent comprehensive property. An introduction about the development situation of copper/aluminum bimetal composite is provided. The research progress on bonding technology, interface behavior, formation and growth rule of intermetallic compounds, microstructure of intermetallic compounds, and diffusion behavior between aluminum and copper, is stated. The mechanical properties and electrical properties of copper/aluminum bimetal composite are presented. Besides, the developing trend is proposed.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2013年第19期1-5,22,共6页
Materials Reports
基金
国家十二五科技支撑计划课题(2011BAE22B01-5)
关键词
铜铝双金属
复合技术
界面行为
金属间化合物
力学性能
电学性能
copper/aluminum bimetal composite, bonding technology, interface behavior, intermetallic compound, mechanical property, electrical property
