电子组装用SnAgCu系无铅钎料的研究进展

Research Development of SnAgCu System Lead-free Solders in Electronics Packing

SnAgCu钎料广泛应用在电子组装领域,被认为是传统SnPb钎料的最佳替代品。但与Sn63Pb37钎料相比,SnAgCu钎料抗氧化能力差,钎料内部及焊点界面存在脆性金属间化合物块及服役期间焊点抗蠕变、疲劳性能较低。添加合金元素和纳米颗粒可以显著改善SnAgCu钎料的组织和性能,提高焊点可靠性。这对发展新型高性能无铅钎料是一个行之有效的办法。本文结合国内外SnAgCu系无铅钎料的最新研究成果,全面阐述了合金元素和纳米颗粒等因素对钎料的润湿性、抗氧化性以及焊点显微组织和可靠性的影响,指明了该钎料目前研究中存在的问题及今后的研究方向。

The SnAgCu solder with a wide application was identified as the best substitute for the tra- ditional SnPb solder in electronic assembly industry. However, this alloy had some weaknesses, such as low anti-oxidation ability, the formation of large, brittle intermetallic compounds at the solder and substrate interface, less creep and fatigue resistance of joints during service condition compared to the euteetic SnPb solder. The microstruetures and properties of SnAgCu alloy can be significantly im- proved with the addition of alloying elements and nanoparticles. Therefore, the reliability of solder joints can be enhanced. It is beneficial for the development novel high-performance SnAgCu solder with element additives. Based on the development of SnAgCu system lead-free solders at home and abroad, this paper summarizes the effects of alloying elements and nano particles on the wettability, anti-oxidization, microstructures, solder joints reliability of SnAgCu system lead-free solders. The present problems in the process of the applications of SnAgCu system lead-free solders are reviewed, some proposals are put forward which may provide a guide for the study of SnAgCu system lead-free solders.