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高功率脉冲磁控溅射制备TiN_x涂层研究

Study on the properties of TiN_x films prepared by high power pulsed magnetron sputtering
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摘要 采用高功率复合脉冲磁控溅射技术(HPPMS)在316不锈钢、硬质合金基体上沉积了TiN薄膜,研究不同N2流量下TiNx膜层的沉积速率、硬度、晶体生长取向、摩擦磨损等性能,并在相同的平均靶电流下与直流磁控溅射制备的TiN薄膜对比。结果表明:HPPMS制备的膜层更加致密,在氩氮流量比为7.4:1时膜层显微硬度达2470 HV,晶粒尺寸也明显小于直流磁控溅射制备的TiN,摩擦磨损性能也得到了改善。 TiN films were prepared by hybrid high power pulsed magnetron sputtering （HPPMS） on the substrates of 316 stainless steel and cemented carbide.We investigated the influence of N2 flow rate on the properties of TiNx films,such as deposition rate,hardness,crystal growth orientation and frictional wear.Under the same average target current,we compared the TiN film with that deposited by direct current magnetron sputtering.The results show that the films prepared by HPPMS are denser.When the Ar/N2 flow ratio is 7.4∶1,the film hardness can reach 2470HV,the grain size are smaller than that prepared by DCMS,and the wearing performance is also improved.
作者 尹星 沈丽如 但敏 杨发展 许泽金 金凡亚
机构地区 核工业西南物理研究院
出处 《真空》 CAS 2013年第5期1-5,共5页 Vacuum
关键词 高功率脉冲磁控溅射 TIN 显微硬度 XRD 摩擦磨损 high power pulsed magnetron sputtering TiN microhardness XRD frictional wear
分类号 TB43 [一般工业技术]
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参考文献18

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