摘要
研究了Ti/Ni/Ti复合层TLP扩散连接Si3N4 陶瓷时压力对接头形成的作用机制。结果表明 ,TLP来不及与陶瓷发生充分反应并形成高强度结合界面就已完全凝固 ,为形成高强度的结合界面 ,必须进一步发生固态扩散反应。只有当连接过程中施加足够的压力 ,才能保证TLP在其存在期间充分铺展陶瓷 ,并在TLP完全凝固后形成大量扩散通道 ,为固态扩散反应提供必要条件。
The mechanism of pressure effect on TLP bonding of Si 3N 4 ceramics with Ti/Ni/Ti multi interlayers was investigated.TLP has solidified before full reaction,which could produce strong interface between TLP and Si 3N 4 ceramics completed. The further solid state diffusion reaction is needed to form strong interface. Appropriate pressure should be imposed on the bonding couples so that a large amount of diffusion channels, which are necessary conditions for further solid state reaction, could be formed during TLP's existing.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2000年第5期76-80,共5页
Aerospace Materials & Technology
基金
国家自然科学基金资助项目!:5 9675 0 0 5 6
