摘要
射频功率电阻的法兰焊接工艺对于该元件的热传导性能及长期可靠工作特性起到关键作用。首先通过对射频功率电阻进行热结构分析,找出影响热传导的关键部位,然后通过软件仿真模拟大功率条件下的温度分布,再通过不同工艺条件的优化改进其性能,最终在采用铜钨合金作为法兰、锡铅焊片作为焊料并辅以助焊剂的条件下制备出热性能良好的射频功率电阻。该电阻在长期寿命实验时其法兰安装处表面温度仅为94℃。
The soldering process for the RF power resistor flange has significant impact on the properties of heat conduction and reliable operation. Firstly, the key parts of the thermal conductivity of RF power resistors was identified by thermal structural analysis. Secondly, the temperature distribution in the high-power conditions was simulated by software. Then, the performance was improved by the optimization of different process conditions. Lastly, the RF power resistor with excellent thermal performance was prepared using of copper tungsten alloy as flange, tin-lead lug as solder and soldering flux as auxiliary material. Results show that the surface temperature of the flange mounting holes in the life test is only 94℃.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2013年第10期45-48,共4页
Electronic Components And Materials
基金
贵州省优秀科技教育人才省长专项资金资助项目(No.201107)
贵州省高层次人才科研条件特助经费资助项目(No.TZJF-2011-57)
关键词
焊接工艺
射频功率电阻
热结构分析
热仿真
焊片
法兰
soldering process
RF power resistors
thermal structural analysis
thermal simulation
lug
flange
