无铅和有铅混装技术研究

Research on Lead-free and Lead Mixed Assembly Technology

提出了无铅、有铅过渡阶段的主要问题——无铅、有铅器件的兼容性和无铅器件、有铅焊料的兼容性问题,以及无铅、有铅混装的2种有效解决方法:1)无铅、有铅兼容性的回流温度测试曲线的优化,既满足无铅器件的焊接,又满足有铅器件的焊接;2)无铅、有铅植球转换,将无铅器件转换为有铅器件,并分别对2种方法进行了相关试验,验证了2种解决方法的可靠性。

The paper presented the main problems occurred in transition stage of lead-free to lead, that is, compatibility of lead-free and lead parts and compatibility of lead solder. Two effective methods were mentioned to solve the problem of lead-free and lead mixed assembly, one is reflow profile optimization of compatibility of lead-free and lead which can not only meet lead-free parts welding, but also can meet the lead parts welding. The other is ball conversion for converting lead-free ball to lead ball. At the same time, corresponding experiments were done to validate the reliability of two methods.