等温时效对SAC305/Ni-P与SACBN/Ni-P界面的影响

Effect of Isothermal Aging on Interfacial Reactions of SAC305/Ni-P and SACBN/Ni-P

研究了Sn-3Ag-0.5Cu(SAC305)/Ni-P与Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni(SACBN)/Ni-P在403、433、463K温度下时效100、400、700、1 000h的界面IMC变化。结果表明,时效前后SAC305/Ni-P与SACBN/Ni-P的界面IMC都是(Ni,Cu)3Sn4与(Cu,Ni)6Sn5,且(Ni,Cu)3Sn4层在(Cu,Ni)6Sn5与Ni-P层之间。随着时效时间的增加,SAC305/Ni-P与SACBN/Ni-P的界面IMC厚度逐渐增加;随着时效温度的增加,两种钎料的界面IMC厚度也逐渐增加。时效后SACBN/Ni-P焊点界面IMC的生长速率略高于SAC305/Ni-P的界面IMC生长速率,且两种钎料界面IMC生长厚度与时效时间t1/2成线性关系,SAC305/Ni-P和SACBN/Ni-P界面IMC的生长激活能分别是65.18和58.36kJ/mol。

Interfacial reactions of SAC305/Ni-P and SACBN/Ni-P were investigated at 403,433, 463 K for 100, 400, 700, 1000 hours. The results show that （Cu,Ni）6Sn5 and （Ni,Cu）3Sn4 intermetallic com- pound layer are generated at the interface between the two solders and electroless Ni-P after isothermal aging~ and the （Ni,Cu）3Sn4 appeares between the （Cu,Ni）6Sn5 layer and Ni-P layer. Meanwhile, with the increase of aging time or aging temperature, thickness of the IMC layer is increased. The growth rate o f the intermetallic layers of the SACBN/Ni-P is a slightly hgiher than that of the SAC305/Ni-P during aging, and the growth rate of two solders~ IMC layer follows a liner relation with square root of aging time. The growth activation energy of IMC of SAC305/Ni-P and the SACBN/Ni-P is 65.18 kJ/ mol and 58.36 kJ/mol, respectively.