水性酚醛/环氧树脂的非等温固化动力学及性能

Non-isothermal cure kinetics and properties of waterborne phenolic /epoxy resin

制备了水性酚醛/环氧树脂(PFR/ER),采用红外光谱(FTIR)、示差扫描量热仪(DSC)、动态力学谱仪(DMA)研究了其非等温固化动力学,测试了玻璃化转变温度(T g)和涂膜的物理力学性能。结果表明,叔胺NN二甲基苄胺可作为该体系固化催化剂,使固化平均表观活化能E a由80.83 kJ/mol降为77.61 kJ/mol;静态固化起始温度T ci、峰顶温度T cp和终了温度T cf分别降低了11,30和53℃左右。非等温固化过程可以ˇSesták-Berggre(S-B)模型描述。材料的T g随着酚醛树脂含量增加呈升高趋势,当酚醛与环氧的质量比为1∶1时,T g达到151.1℃。涂膜铅笔硬度3H以上,附着力1级,耐冲击性25 N以上。

The waterborne phenolic/epoxy resin （PFR/ER） was prepared. The non - isothermal cure kinetics of PFR/ER was investigated by FTIR, DSC and DMA. The glass transition temperature Ts and coating properties were tested. The results showed that the tertiary amine could be used as curing catalyst for the system. The average apparent activation energy Ea was decreased from 80. 83 into 77.61 kJ/mol. The static curing initiation temperature Tci, peak temperature Tcp and end temperature Ta were decreased by about 11, 30 and 53 ℃, respectively. The curing reaction could be described by autocatalytic Sestak - Berggre （ S - B） model. The Ts of the material was increased with the increasing of phenolic resin content. The Ts of cured PFR/ER with mass ratio of phenolic resin to epoxy resin 1：1 was 151.1 ℃. The pencil hardness , adhesion and impact resistance of the film were 3H , 1 level and than 25 N , respectively.