木材厚度上含水率偏差对胶接界面的影响

Effect of Moisture Content Tolerance through the Lumber Thickness on the Bonding Interface

应用光电子能谱仪研究了木材厚度上含水率偏差的变化对木材表面活性基团及胶接界面性质的影响。结果表明:含水率偏差的增加会导致胶接界面O1s逐渐减小使胶接强度下降;偏差控制在0.5%～1.0%可以达到较好的胶接界面。

The experiment was conducted to study the effect of the moisture content （ MC ） tolerance on wood surface and the bonding interface by XPS. The Ols on bonding interface will be decreased with the increasing of the MC tolerance and the glue strength will be declined, accordingly. The MC tolerance should be in 0.5%-1.0% for better bounding interface.