碱性蚀刻的不良分析和改善

Failure analysis and improvement of alkaline etching

蚀刻工艺是印制线路板制作过程中一个非常重要的步骤,怎样提高蚀刻均匀性,降低蚀刻报废,非常的重要。设计方面:不同厚度的底铜做相应的补偿;设备方面:要从喷咀类型、喷咀方向、喷咀到板距离、蚀刻抽风量、蚀刻液的喷淋压力、防卡板上控制;药水和工艺方面:要从配制子液、蚀刻母液的氯铜比、蚀刻液温度、蚀刻液PH值等进行控制;检验方面:要从首末件的确认上控制批量蚀刻不良的流出。

The etching process is very important process step for printed circuits board. How to improve etching uniformity and reduce scrap etching are very important as well. We consider the following factors： 1） design： different thickness bottom copper with appropriate compensation; 2） Equipment： from the nozzle type, nozzle orientation, nozzle to board spacing , etching ventilation volume, etching liquid spray presstlre, protect board control; 3） Solution and technology： from tile preparation of sub -solution, Copper chloride etching liqnor ratio, etching solution temperature, etching liquid PH value control 4） Inspection： the confirmation is from the first and last piece board to control the bulk of defective etching board outflow.