摘要
文章简单介绍了电极反应速度理论和流体力学理论,从理论上找到解决提高高厚径比PCB板件深镀能力的研究方法;电镀反应包括液相传质步骤、电化学步骤、新相生成步骤;流体流动主要有层流和湍流两种方式,两者的转换条件判断为雷诺数数值;通过电化学极化曲线比较了底喷,侧喷,鼓气对深镀能力贡献不同的影响,从理论上分析了底喷效果优于其它两种溶液交换方式的原因,证明底部喷流方式对于高厚径比通孔电镀是最优选择,讨论了喷流流量大小对深镀能力提高的贡献。
This article simply introduces hydrodynamics theory, electrode reaction theory and figures out the researching rnethod to improve the throwing power in high aspect ratio PCB plating theoretically. The plating reaction includes mass transfer, charge transfer and fresh medium creation steps. There are two modes in liquid flow. They are laminar flow and onflow. Re is the judge parameter between each other. The different effect of bottom spray, side spray and air agitation to improve the throwing power in plating is discussed by polar curve. The effect of bottom spray is better than other two solution exchange modes in theoretically analysis. The bottom spray that is tile best choice to high aspect ratio PCB plating is proved. The contribution of the spray rate to improve the throwing power is discussed.
出处
《印制电路信息》
2013年第10期33-37,41,共6页
Printed Circuit Information
关键词
喷流流量
底喷
侧喷
鼓气
深镀能力
Spray Rate
Bottom Spray
Side Spray
Air Agitation
Throwing Power
