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有机硅改性UV固化水性环氧树脂的研究 被引量:6

Study on Organosilicone Modified Waterborne UV-Cured Epoxy Resin
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摘要 以环氧树脂E-51、甲基三乙氧基硅烷为原料,用接枝共聚的方法合成了有机硅改性水溶性UV固化环氧树脂,该方法有效地改善了环氧树脂的柔韧性、水溶解性,提高了成膜物的机械性能,其拉伸强度达到53.5 MPa,断裂伸长率为46.5%,耐冲击性大于50 kg/cm。通过红外光谱、热重分析表征产物的结构和性能,结果表明,有机硅已经成功接枝到环氧树脂的分子上。有机硅改性后环氧树脂在400℃的分解率由之前的60%降至40%。文章同时讨论了有机硅改性水性UV固化环氧树脂合成中反应温度、有机硅种类以及加入量等对UV固化水性环氧树脂成膜物的附着力、耐水性及耐碱性的影响,以此获得最佳反应条件:质量分数为14.4%的甲基三乙氧基硅烷与羧酸改性的环氧树脂在90℃下反应5~6 h。 Organosilicon-modified water-soluble UV curable epoxy resin was synthesiaed with the graft copolymerization method using Epoxy resin E-51 andmethyl triethoxysilane as raw materials, and the flexibility, the water solubility and the mechanical properties of the curable resin was effectively improved, with the tensile strength 53.5 MPa, elongation at break 46.5%, impact resistance greater than 50 kg/cm. The morphologies of modified epoxies were investigated using infrared spectroscopy (IR) and thermogravimetric analysis (TG), and it showed that the organosilicone was successfully introduced to epoxy resin, and at 400℃, the decomposition rate lowered to 40% from 60% before the modification. And it also discussed the impact of the reaction temperature, and the kind and amount of organosilicon to the adhesion, water resistance and alkali resistance, and then we got the best formula: methyl triethoxy-silane with the mass fraction of 14.4% and carboxylic acid-modified epoxy resin reacted at 90℃ for 5-6 h.
出处 《广州化学》 CAS 2013年第3期6-11,共6页 Guangzhou Chemistry
基金 广东省中国科学院全面战略合作项目(No.2012B090400033)
关键词 有机硅 环氧树脂 水性树脂 UV固化 organosilicon epoxy resin waterborne UV-curable
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