摘要
以循环伏安法研究了锡、铜、镍离子在电解着色条件下的电化学行为 ,实验结果表明 ,当锡、铜、镍离子共存于电解质溶液中 ,以交流电作电解电源时 ,锡、铜将优先于镍沉积于铝合金表面上 ,形成亮黑色的坚实膜层 ,电沉积 1 0 min,膜层厚度大于 4μm。以扫描电镜分析了膜层的表面形貌 ,用 X-射线电子能谱分析了膜层的成分及锡。
The electrochemical behaviors of Sn 2+ , Cu 2+ , Ni 2+ in the electrolytic coloring bath for aluminium alloys have been reserched by cyclic voltammetry. The experimental results indicat that copper and tin compounds will be deposited predominantly on the aluminium alloys and form a deep black color and solid film. The film thickness and the composition have been determinated by the Scanning Electro Microscopy and XPS techniques.
出处
《电镀与精饰》
CAS
2000年第6期5-7,共3页
Plating & Finishing