利用载玻片刻蚀微流检测芯片的关键工艺

Key Technique of Glass Microfluidic Chips Etching Production Process on Slide

为克服石英玻璃和Pyrex7740玻璃制作微流检测芯片价格昂贵、工艺流程复杂等不足，节约制作成本，简化制作步骤，缩短制作周期，设计利用普通钠钙玻璃（soda-limeglass）载玻片为基质，正光刻胶AZ4620为掩膜牺牲层，进行高效、快速、低成本的微流检测芯片制作。系统地研究了载玻片的预处理、光刻胶旋涂、各阶段烘焙参数、曝光显影量、刻蚀环境及玻璃腐蚀液成分配比等关键工艺参数，解决光刻胶与玻璃的黏附性，光刻胶在腐蚀液中的耐受时间等问题。工艺优化后刻蚀深度达到80μm，最小特征尺寸小于50μm，微流管道侧壁陡直度小于100°，底部平整度误差小于±1．5μm，制作周期仅需4h左右。

Concerning the higher cost and complex process, etc. in the production of microfluidic chips, the ordinary slide, a kind of soda- lime glass as substrate carrier and positive photoresist AZ 4620 as sacrificial layer, be the altemative, characterized by economic effectiveness, simplicity and short manufacture cycle. In this paper, the following aspects have been systematically investigated in details, including the pretreatment of glass slide, photoresist coating, various stages of baking parameters, exposure and developer volume, etching environment and the glass buffered oxide etch＇s ratio, systematically, and then the solution to the adhesion problem of the photoresist with the glass, photoresist＇s tolerance time in buffered oxide etch. After the optimization,, the etching depth can reach 80 gin, the minimum feature size could be less than 50 gm, the sidewall steepness is less than 100~, the flatness error is less than ~ 1.5 gin, and the production cycle takes just 4 h.