摘要
氧化铝陶瓷在成型、烧成以及机加工等过程中都会或多或少的产生一些微观缺陷,分析了几类常见微观缺陷,提出避免缺陷产生的相关措施。
During the molding,sintering and machining process,various micro-defects often appear,several kinds of common defects of alumina ceramic substrates prepared by gelcasting were described,and relevant measures were put forward.
出处
《真空电子技术》
2013年第4期64-68,共5页
Vacuum Electronics
关键词
微观缺陷
团聚
气孔
微裂纹
夹杂物
Microdefect
Reunion Agglomeration
Pore
Micro-crack
Inclusion