摘要
以氮化铝粉末为原料,添加5%Y2O3,通过注射成形工艺,制备出全致密、热导率为182 W/m·K的氮化铝陶瓷。研究了氮化铝陶瓷烧结过程中致密过程及组织变化,合理制订了复杂形状氮化铝陶瓷的烧结工艺,制备出了高尺寸精度,高热导率的氮化铝电子封装零件。
Aluminium nitride ceramics were fabricated from aluminium nitride powders add 5 ％Y2O3 by powder injection molding,the sintering body was full density and thermal conductivity was 182 W/m · K.Procedures of body densification and structure change during sintering process were studied.High dimensional accuracy and thermal conductivity AlN electronics packaging parts with complex shape were fabricated by optimized the sintering process.
出处
《真空电子技术》
2013年第4期69-72,共4页
Vacuum Electronics
关键词
粉末注射成形
氮化铝
烧结
热导率
Powder injection molding
Aluminium nitride
Sintering
Thermal conductivity
