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热压烧结工艺对WC-Cu-Sn涂层组织性能的影响

Effect of hot pressing process on microstructure and performance of WC-Cu-Sn coating
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摘要 采用热压技术在45#钢基片表面制备WC-Cu-Sn耐磨涂层,对影响WC-Cu-Sn涂层组织性能的主要工艺因素WC含量、烧结温度和烧结时间进行了正交试验设计及极差分析。结果表明,WC质量分数47%、烧结温度850℃、烧结时间1min为涂层的最佳工艺参数,该工艺条件下的47WC-Cu-8Sn涂层组织相对耐磨系数高达12,其致密度随烧结温度升高先增大后减小,随烧结时间延长逐渐减小;WC-Cu-Sn涂层磨损机制主要以磨粒磨损为主、黏着磨损为辅。 WC-Cu-Sn coating was prepared on the surface of 45 steel by hot pressing process, and WC content, sintering temperature and sintering time that influence the microstructure and performance of WC-Cu-Sn coating were studied by orthogonal tests. The results show that 47 % WC, 850℃ and 1 rain are the best process parameters, which Yield a 47WC-Cu-8Sn coating whose relative wear resist- ance coefficient reaches 12 and whose density increases first and then decreases with the sintering tem- perature while decreases gradually with the sintering time. Wear mechanism of the coating is mainly abrasive wear added with adhesive wear.
出处 《武汉科技大学学报》 CAS 2013年第5期348-352,共5页 Journal of Wuhan University of Science and Technology
关键词 WC颗粒 WC-Cu—Sn涂层 热压烧结 正交试验 磨粒磨损 WC particle WC-Cu-Sn coating hot pressing sintering orthogonal test abrasive wear
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