W粉粒度及样品单重对电子封装用W-10Cu复合材料性能的影响

Influences of Particle Size and Single Sample Weight of W Powders on the Properties of W-10Cu Composite Materials for Electronic Packing

采用高速压制成形-冷锻-渗铜的方法制备了W-10Cu复合材料,并探讨了W粉粒度及样品单重对材料组织与性能的影响。结果表明:冷锻前后W骨架的相对密度均随W粉样品单重的增加而降低;压制后混合粉W骨架的相对密度最大,但仍未达到W-10Cu复合材料对W骨架相对密度不小于81%的要求;经冷锻后,三种粒度W骨架的相对密度的最大值均达到81%,其中,中粒度粉W骨架的相对密度最大;三种粒度的W粉均可通过高速压制成形-冷锻-渗铜的方法制备出组织均匀致密、满足电子封装材料性能要求的W-10Cu复合材料。

Abstraet..W-10Cu composite materials were prepared by high velocity compaction-cold forging-copper infil tration. Meanwhile,investigation was made on the influences of particle size and single sample weight of W powders on the microstructure and properties of the materials. The results show that the relative density of W skeleton decreases with the increase of single sample weight before and after cold forging. Upon compaction of the mixed powders,W skeleton has the greatest relative density,yet it is not satisfactory to W-10Cu composite material,of which the relative density should be no less than 81%. By cold forging,the maximum relative density of all the types o{ W skeletons can reach 81%, and among them W skeleton com- pacted with medium-grained powders has the greatest relative density. The W-10Cu composite materials with dense and uniform microstructure can be prepared by high velocity compaction-cold forging-copper in- filtration with three types of powders and they can also meet the performance requirement for electronic packaging materials. Keywords ： W-10Cu ; W powders ; particle size; single sample weight; W skeleton; electronic packing