形变及热处理对白铜B10合金晶界特征分布的影响

Effect of deformation and heat-treatment on grain boundary distribution character of cupronickel B10 alloy

研究晶界工程处理过程中的冷轧变形量和再结晶退火对白铜B10合金晶界特征分布的影响,采用电子背散射衍射(EBSD)技术表征分析晶界网络的变化。结果表明:白铜B10合金经冷轧7%后在800℃退火10 min可使低ΣCSL(Coincidence site lattice,Σ≤29)晶界比例提高到75%以上,同时形成尺寸较大的"互有Σ3n取向关系晶粒的团簇"显微组织。当变形量小于7%时,经800℃退火后没有完全再结晶;当变形量大于7%时,低ΣCSL晶界比例和平均晶粒团簇的尺寸随冷轧变形量的增加而下降。

The effects of cold rolling deformation and annealing on the grain boundary character distribution （GBCD） during grain boundary engineering （GBE） treatment were investigated by electron backscatter diffraction （EBSD） in cupronickel B10 alloy. The results show that the proportion of low-Σ CSL （Coincidence site lattice, Σ≤29） grain boundaries increase to more than 75% by 7% cold rolling and subsequent annealing at 800 ℃. In this case, the grain boundary network （GBN） is featured by the formation of highly twinned large size grain-clusters produced by multiple twinning during recrystallization. When the cold rolling deformation amount is less than 7%, the 800℃annealing can not induce perfect recrystallization. The perfect recrystallization occurs when the deformation amount is more than 7%, and the proportion of low-ΣCSL grain boundaries and the average size of grain-clusters decrease with the increase of the cold rolling reduction ratio.