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Morphological evolution of tunnel tips for aluminum foils during DC etching 被引量:6

Morphological evolution of tunnel tips for aluminum foils during DC etching
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摘要 The morphologies of tunnel tips in different stages for aluminum foils during DC etching in 1.5 mol/L HC1 solution at 90℃ were observed by field emission scanning electron microscopy (FE-SEM). A novel model was proposed to describe the morphological evolution of tunnel tips throughout the growth processes. In the pit nucleation stage, the pits vary from the hemispherical to half-cubic shapes due to the activation of pit tips from the center to the edge. During the tunnel growth stage, the pits dissolve toward the depth direction and develop into the tunnels, and their tips remain flat. In the tip passivation stage, as the passivation of tunnel tips speeds up from the edge to the center's the tunnel tips change from flat shapes to three-dimensional protrusions. The mechanism may be attributed to the order of activation or passivation on the tunnel tips changed in different stages. The morphologies of tunnel tips in different stages for aluminum foils during DC etching in 1.5 mol/L HC1 solution at 90℃ were observed by field emission scanning electron microscopy (FE-SEM). A novel model was proposed to describe the morphological evolution of tunnel tips throughout the growth processes. In the pit nucleation stage, the pits vary from the hemispherical to half-cubic shapes due to the activation of pit tips from the center to the edge. During the tunnel growth stage, the pits dissolve toward the depth direction and develop into the tunnels, and their tips remain flat. In the tip passivation stage, as the passivation of tunnel tips speeds up from the edge to the center's the tunnel tips change from flat shapes to three-dimensional protrusions. The mechanism may be attributed to the order of activation or passivation on the tunnel tips changed in different stages.
出处 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2013年第10期961-966,共6页 矿物冶金与材料学报(英文版)
基金 the financial support by the Guangxi Hezhou Guidong Electronics Technology Co.Ltd. the Research Project of Guangxi Zhuang Autonomous Region(Nos.1346011-7 and 1298019-11)
关键词 ALUMINUM corrosion PITTING POLARIZATION ETCHING electrolytic capacitors aluminum corrosion pitting polarization etching electrolytic capacitors
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  • 1R.S. Alwitt, H. Uchi, T.R. Beck, and R.C. Alkire, Elec- trochemical tunnel etching of aluminum, J. Electrochem. Soc., 131(1984), No. 1, p. 13.
  • 2K. Hebert and R. Alkire, Growth rates of aluminum etch tunnels, J. Electrochem. Soc., 135(1988), No. 10, p. 2447.
  • 3E. Makino, T. Yajima, T. Shibata, M. Ikeda, Y. Tanno, and E. Suganuma, In situ observations of growing pits during tunnel etching of aluminum, Mater. Trans. JIM, 34(1993), No. 9, p. 796.
  • 4Z. Szklarska-Smialowska, Pitting corrosion of aluminum, Corros. Sci., 41(1999), No. 9, p. 1743.
  • 5N. Osawa and K. Fukuoka, Pit nucleation behavior of alu- mlnium foil for electrolytic capacitors during early stage of DC etching, Corros. Sci., 42(2000), No. 3, p. 585.
  • 6E. McCafferty, Sequence of steps in the pitting of aluminum by chloride ions, Corros. Sci., 45(2003), No. 7, p. 1421.
  • 7R.G. Xiao, K.P. Yan, J.X. Yan, and J.Z. Wang, Electro- chemical etching model in aluminum foil for capacitor, Cor- ros. Sci., 50(2008), No. 6, p. 1576.
  • 8S. Ono and H. Habazak, Effect of sulfuric acid on pit prop- agation behaviour of aluminium under AC etch process, Corros. Sci., 51(2009), No. 10, p. 2364.
  • 9S. Ono and H. Habazaki, Pit growth behaviour of aluminium under galvanostatic control, Corros. Sci., 53 (2011), No. 11, p. 3521.
  • 10H. Sheng, C.F. Dong, K. Xiao, X.G. Li, and L. Lu, Anodic dissolution of a crack tip at AA2024-T351 in 3.5wt% NaC1 solution, Int. J. Miner. Metall. Mater., 19(2012), No. 10,p. 939.

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