采用分离膜脱模的硅胶球面封装——大功率LED产品封装的方向

Adopt the separation membrane stripping as the solution of mold release for Silica gel sphere packing——The way for the high-power LED Packing

介绍了大功率LED产品的封装工艺,分析了大功率LED产品的发展趋势及封装工艺的变化,总结了采用分离膜脱模的硅胶球面封装在大功率LED产品封装工艺上的使用方法。

This paper introduces the packing process and the way in future for the LED product. At the same time, this paper introduces the solution which adopts the separation membrane stripping as the mold release for Silica gel sphere packing.