摘要
随着科技的进步,电子设备也向着集成度更高、功率更大、可靠性要求更严格的方向发展。高温引起的电子设备失效作为最常见的失效原因之一,也越来越引起设计者的重视。通过常规的制备样品反复试验的方法耗时耗力,而采用仿真模拟的办法就能很好地解决问题。文章从使用高导热封装材料、添加散热盖和改善封装结构等方面,应用仿真模拟的手段来比较各种优化设计的改善程度,在散热优化方面为今后的BGA设计提供了参考。
Thermal management of packaging is very important to the reliability and quality of electrical products. In this study, a simulation method is proposed to evaluate the thermal performance of BGA609P attached on printed circuit board （PCB） . Flotherm Computational Fluid Dynamics （CFD） software is employed to predict the package thermal performance. The simulation results show that thermal conductivity of BT material, thermal conductivity of molding compound, structural change of via and substrate, produce some opening in solder-mask have significant impact on thermal resistance of BGA609P.
出处
《电子与封装》
2013年第9期10-13,共4页
Electronics & Packaging
关键词
封装产品
仿真
BGA
散热优化
packaging
simulation
BGA
thermal performance
