摘要
综述了全球CMP设备市场概况及适应 0 1 8μm工艺平坦化要求的CMP技术现状 ,给出了向30 0mm圆片转移过程中CMP技术占用成本及CMP设备性能指标。
The market survey of worldwide CMP equipment and the present situation of CMP techniques meet the need of 0 18 μm process planarization is described At the ending, the CoO of the CMP techniques moving to 300 mm technology and the production tool performance targets for 300 mm CMP equipment is shown
出处
《电子工业专用设备》
2000年第4期11-18,共8页
Equipment for Electronic Products Manufacturing
关键词
CMP设备
半导体
微电子
平面化技术
CMP
Equipment
Market
Cu interconnect
300 mm technology
Planarization
