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基于物理分析的大信号HBT模型

A Physics-Based HBT Model for Large-Signal Application
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摘要 :本文利用物理参数提取大信号HBT模型。首先 ,推导并提出器件的模型 ,对模型中各参数含义作了分析和阐述 ,将模型分为本征模型和外模型。本模型利用二级管来模拟复合效应 ,同时还考虑器件的热效应。其次 ,采用SPICE模拟器件的IC -Vce特性曲线并和参考文献中的特性曲线作分析对比。 The article extracts a large-signal HBT model by means of physical parameters.At first,we have turned out and deduced the model,detailed and analysed its parameters.The model can be devided into two parts:intrinsic modle and extrinsic mode.In order to simulate recombination effects,we use a diode.In addition to it,thermal effects can be invoved.Secondly,we have simulated IC-Vce characterisitc using SPICE and compared them with those of references.
出处 《杭州电子工业学院学报》 2000年第6期89-91,共3页 Journal of Hangzhou Institute of Electronic Engineering
关键词 模型 本征模型 热效应 model intrinsic model thermal effects
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参考文献4

  • 1S C Jaint,D J Roulston.A Simple Expression For Band Gap Narrowing(BGN)In Heavily Doped Si, Ge, GaAs And Gex Si1-x Strained Layers[].Solid State Electronics.1991
  • 2Shawn Searles,Davildi L Pulfrey.An Analysis of Space-Charge-Region Recombination in HBT’S[].IEEE Transactions Electron on Devices.1994
  • 3J J X Feng,D L Pulfrey.A Phsics-Based HBT SPICE Mode For Large-Signal Applications[].IEEE Transactions Electron on Dveices.1995
  • 4Dale e Dawson,Aditya K GuPta Mike,L Salib.CW Measurement of HBT Thermal Resistance[].IEEE Transactions Elecrton Devices.1992

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