MAIP镀TiN工艺对膜基结合的影响

Influence of MAIP Plating TiN Technology on the Bonding Strength between the Film and the Substrate

本文介绍了用多弧离子镀膜(MAIP)技术在高速钢基片表面镀TiN工艺。通过离子轰击清洁和加热后,工件施加高的偏压并同时打开弧源,在膜基界面形成Ti、N、Fe、W、Mo的交混层。这层伪扩散层的存在,提高了膜基结合强度,为该膜的应用奠定了良好的基础。

This paper introduced the technology of plating TiN on the surface of high speed steel by multi- arc ion plating technique. While ion bombarded sputtering for cleaning and heating, loading a high nega- tive bias voltage was applied on the substrate and opened are source, and the mixing layer of Ti, N, Fe, W, Mo was formed on interface of the film and substrate. The mixing layer was pseudo diffusion layer, which could be used for enhancing the bonding strength between the film and the substrate, and for the ap- plication of the film had laid a good foundation.