紫铜化学镀Ni-P合金工艺

Technology of Electroless Ni-P Alloy on Copper

以酸性含锌活化液活化紫铜基体，获得了化学镀Ni-P合金镀层。采用正交试验法，研究了锌粉含量、活化温度、活化时间以及施镀时间对Ni-P合金镀层性能的影响，优化得到了试验范围内的最佳工艺参数：锌粉含量为9g/L，活化温度为60～70℃，活化时间为90S，施镀时间为80min。以此工艺参数获得的镀层与紫铜基体结合良好，沉积速率为10．13μm/h，显微硬度可达578．3HV0.91，无孔隙缺陷，并且镀层为非晶态结构，其含P量为11．83％。这将大大提高紫铜基体的耐磨性和耐蚀性。

The electroless Ni-P alloy coating was obtained on the copper base activated by the acid activation solution with zinc. The effects of zinc content, activation temperature, activation time and plating time on Ni-P alloy coating were investigated by the orthogonal test. The optimal process parameters were obtained： zinc content 9 g/L, activation temperature 60-70 ℃, activation time 90 s, and plating time 80 min. Through these process parameters, the coating has a good combination with the copper base, the deposition rate is 10.13 μm/h, the micro-hardness reaches 578.3 HV0 01 , and the Ni-P alloy coating with 11.83 % P and without void defect is a morphous structure. The wear resistance and corrosion resistance of copper have significantly been improved.