基于Moldflow和UDE的打印机上盖翘曲变形工艺参数优化

Optimization of process parameters to decrease the warpage of printer cover based on Moldflow and UDE

基于Moldflow和均匀试验设计(UDE)方法,对某打印机上盖进行"冷却+流动+翘曲"模拟分析,以打印机上盖的翘曲变形量为试验指标,模具温度、熔体温度、保压压力、保压时间和注射时间为设计变量,建立了翘曲变形回归方程优化工艺参数。试验表明,通过UDE方法,有效减少了多因素多水平试验次数,并获得了最佳工艺参数组合,通过SPSS19.0统计软件实现回归分析,得出各个设计变量对试验指标的影响程度,并将因素按重要性进行了排序。

Based on Moldflow and UDE method, a ＂cooling＋flowing＋warpage＂ simulation analysis was made on a printer cover in which the amount of warpage was set as the ex- perimental index, the mould temperature, melt temperature, packing pressure, packing time and injection time as design variables, the regression equation of warpage was established to optimize the processing parameters. The experiments show that through multilevel UDE method, the number of experiments can be effectively reduced and the optimal combina- tion of process parameters was obtained. It also concludes that every design variable has certain influence on the experimental indexes, and the importance of factors was se- quenced according to the regression analysis by SPSS19.0 statistical software.