热激励谐振式硅微结构压力传感器

THERMAL EXCITED SILICON MICROSTRUCTURE RESONATOR PRESSURE SENSOR

对一种以方形硅膜片作为一次敏感元件 ,硅梁作为二次敏感元件的热激励硅谐振式压力微传感器进行了较系统的研究 :建立了微传感器敏感结构的工程用数学模型 ;以所建立的模型实际设计了敏感结构参数 :方形膜边长 4 mm,膜厚 0 .1 mm,梁谐振子长 1 .3mm,宽 0 .0 8mm ,厚 0 .0 0 7mm ;采用微机械加工工艺加工出了原理样件 ;采用电热激励。

A thermal excited silicon resonant pressure microsensor whose preliminary sensing unit is a square silicon diaphragm, and the final sensing unit is a silicon beam resonator, was investigated systematically A mathematical model of the above sensing structure was established in engineering Based on the above model and theoretical analyzing results, the principle sample of the above sensing structure was designed and manufactured by using the micro mechanical technology The parameters of the sensing structure are as follows: length 4 mm,thickness 0 1 mm,for the diaphragm; length 1 3 mm,width 0 08 mm and thickness 0 007 mm for the beam resonator The open loop tests for the resonator of the sensor were carried out with the thermal resistance exciter and piezo resistance detector