Ni添加对SnAgCuRE钎料组织与性能的影响

Effects of Ni adding on microstructure and properties of SnAgCuRE solder

利用扫描电镜、X射线衍射仪等检测手段,研究了Ni添加对Sn2.5Ag0.7Cu0.1RE钎料及其钎焊接头显微组织和性能的影响。结果表明,添加微量Ni能显著细化钎料显微组织,抑制钎焊接头界面区IMC的产生,降低IMC的厚度,提高钎料及钎焊接头的性能。当w(Ni)为0.05%时,钎料合金组织细小均匀,共晶组织所占比例增多,钎焊接头界面IMC薄而平整,钎料的伸长率及钎焊接头的剪切强度达到最大值,分别较未添加Ni时提高了14.7%和4.5%。过量的Ni添加会导致钎料及钎焊接头性能降低。

The effects of Ni adding on microstructures and properties of Sn2.5Ag0.7Cu0.1RE solder alloy and solder joints were examined by SEM and XRD, etc. The results indicate that adding tiny Ni can refine the microstructure, suppress the growth of IMC at the interface of joints and reduce the thickness of IMC, improve the properties of solder alloy and solder joints. When addition w（Ni） is 0.05%, the solder structure is fine and homogenous, eutectic structure increases, IMC is thin and flat, the elongation and shear strength get the maximum, which separately are 14.7% and 4.5% higher than that of the solder without Ni. However, the addition of excessive amount of Ni can lead to the decline of properties.