摘要
热冲击和机械振动是导致集成电路封装中键合金丝失效的两大主要诱因。为此,开展了键合金丝(楔形焊)热冲击和机械振动的仿真及试验研究。结果表明,热应力集中在金丝的根部,即焊点区;振动时,跨距和拱度都较大的金丝容易被振脱落,仿真与试验所得结果基本一致,表明了仿真分析方法在键合金丝可靠性试验研究中具有非常重要的指导意义,并提出了热-机械振动耦合仿真方法,可作为键合金丝可靠性研究的评价标准。
The thermal shock and mechanical vibration are the main causes of gold bonding wires invalidity in an integrated circuit package. Therefore, the study of gold bonding wires simulation and experiment was carried out on the thermal shock and mechanical vibration. Results show that the thermal stress concentrates the root of the gold bonding wires, which is soldering point zone. When vibrating, the soldering points of bigger span and the bigger camber wires are more easily induced shedding. The simulation results and experiment results are consistent, which shows simulation analysis method has a very important significance in the study of reliability of gold bonding wires, and put forward the thermal-mechanical vibration coupling analysis method, which can be used as the reliability evaluation standard of gold bonding wires.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2013年第11期65-68,共4页
Electronic Components And Materials
关键词
键合金丝
可靠性
焊点
仿真
热冲击
机械振动
热-机械振动耦合
gold bonding wire
reliability
soldering point
simulation
thermal shock
mechanical vibration
thermal-mechanical vibration coupling
