摘要
针对于高阻衬底、高阻外延工艺与常规CMOS工艺的兼容性进行研究,主要讨论了CMOS外延工艺中确定有效外延层厚度的实验过程。
This paper describes the research on the compatibility of high resistance substrate for high resistance epitaxial process and the conventional CMOS process.It mainly discusses the experimental process for the determination of effective thickness of epitaxial layers in the process of CMOS epitaxial.
出处
《微处理机》
2013年第2期9-11,共3页
Microprocessors
关键词
有效外延厚度
隔离
高阻衬底
Effective epitaxial thickness
Isolation
High resistance substrate