摘要
为了增强低温镀铁层与基体的结合强度,采用锉刀法、弯曲法、加热法定性研究了镀液pH值、温度、电流密度、主盐浓度对低温镀铁层结合强度的影响,并采用扫描电镜(SEM)分析了镀层与基体结合的微观形貌。结果表明:pH值为1.0,电流密度为14 A/dm2,温度为50℃,FeCl2·4H2O浓度为400 g/L时,镀层与基体结合强度最高,此时镀层与基体间的过渡层呈曲面;过渡层呈曲面时比呈平面时的结合强度更高。
The influences of the pH value,temperature and major salt concentration of plating bath as well as current density on the bonding strength of lowered-temperature electroplated Fe coating with substrate were qualitatively investigated with file method, bending method and heating method,while the morphology of as-plated Fe coating was observed with a scanning electron microscope. Results showed that Fe coating obtained at a bath pH of 1. 0,temperature of 50 ℃,and major salt( FeCl 2 ·4H 2 O) concentration of 400 g / L as well as a current density of 14 A / dm2 had the highest bonding strength with substrate. Between resultant Fe coating and substrate a curve-like interface was formed.
出处
《材料保护》
CAS
CSCD
北大核心
2013年第10期15-17,5,共3页
Materials Protection
关键词
低温镀铁层
PH值
电流密度
温度
主盐浓度
结合强度
结合形貌
lowered-temperature electroplated Fe coating
pH value
current density
temperature
concentration of major salt
bonding strength
morphology
