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微波组件激光封焊的温度场仿真 被引量:5

Numerical Simulation on Temperature Field of Microwave Modules in Laser Seal Welding
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摘要 基于高斯面热源加三维锥体热源的组合热源模型和ANSYS有限元软件,建立了高硅铝合金微波组件壳体的激光焊接数值分析模型。使用三角周期函数实现热源功率的循环加载。通过激光焊接过程的热仿真,分析了密封焊接过程中,微波壳体四条边的温度分布规律以及温度变化趋势。仿真结果表明,焊缝中心的温度随着焊接过程的持续进行而不断升高,焊接速度的提高也导致焊缝中心温度增加。此外,焊接过程中,铝硅壳体温度也持续上升,第4道焊缝收弧时,该点附近底板温度已经达到210℃,会损害底板上电子元器件的性能。 Based on the combination model of a Gaussian surface heat source plus a three-dimensional cone heat source, using ANSYS finite element software, the numerical analysis model for high silicon content aluminum alloy microwave module shell during laser welding is built. Cyclic loading of the heat source power is achieved by using periodic trigonometric tunction. According to the heat simulation of laser welding procedure, temperature distribu- tion and change tendency in the four side of the microwave module shell in welding procedure are analyzed. Simula- tion results show that the temperature of welding line center increases as welding process continues, and the in- crease of welding speed also raises the temperature. Moreover, shell temperature rises continuously in welding process. At the end of the forth welding line, the temperature near the end at the bottom plate is 220 ℃, and the properties of the electronic components at the bottom plate will be degraded by such a high temperature.
作者 栾兆菊
出处 《电子机械工程》 2013年第5期38-40,43,共4页 Electro-Mechanical Engineering
关键词 微波组件 高硅铝合金 激光焊接 数值仿真 microwave module high silicon content aluminum alloy laser welding numerical simulation
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