摘要
银的电结晶过程直接影响银镀层的性能,但目前很少关注聚乙烯亚胺(PEI)对银电沉积过程的影响。采用循环伏安、计时电流及交流阻抗技术研究了硫代硫酸盐体系中添加PEI前后银电沉积的电化学行为,结合扫描电镜分析了银的电结晶方式。结果表明:PEI对银在硫代硫酸盐体系中的电沉积有阻化作用,添加0.08 g/L PEI可使反应电阻由176.3Ω·cm2增至427.1Ω·cm2;加入PEI不改变银的电结晶形核机理,银仍按三维连续成核方式生长,PEI能提高银电结晶成核速度,但会抑制晶体向外生长。
The electrochemical behavior of silver deposition in the presence or absence of polyethyleneimine( PEI) from a thiosulphate bath was investigated by means of cyclic voltammetry,chronoamperometry,and electrochemical impedance spectroscopy. Besides,a scanning electron microscope was performed to investigate the electrocrystallization mode of silver. It was found that PEI inhibited the electrodeposition of silver from thiosulphate bath. Namely,introducing 0. 08 g / L of PEI caused increase of reaction resistance from 176. 3 Ω · cm2to 427. 1 Ω·cm2. Besides,PEI didn 't affect the electrocrystallization and nucleation mechanism of silver,and silver grew in a three-dimensional continuous nucleation mode. Furthermore,PEI was able to accelerate the electrocrystallization and nucleation rate of silver,but it inhibited the epitaxial growth of silver crystal.
出处
《材料保护》
CAS
CSCD
北大核心
2013年第11期17-19,23,共4页
Materials Protection
关键词
电沉积
银
电结晶
聚乙烯亚胺(PEI)
硫代硫酸盐体系
electrodeposition behavior
silver
electrocrystalliza-tion
polyethyleneimine additive
thiosulphate
