定点射流电铸的仿真与实验

Simulation and Experiment of Fixed Point Jet Electroforming

通过建立定点射流电铸的数学模型,对沉积层的生长形态进行了仿真。采用圆形出口的喷嘴进行了铜定点射流电铸的实验,结果表明:铜沉积层呈现中间厚,边缘薄的圆饼型结构,这与定点射流电铸仿真结果基本一致,验证了模型的正确性。对射流电铸的流场和电场进行了分析,发现射流电铸流场高组分区域对电场分布影响较大,与喷嘴出口中心位置对应的阴极表面电场较强,距中心位置越远电场越弱,这导致了在阴极表面的各处的沉积速度不同,最后影响到了铜沉积层的生长形态。

By establishing fixed point jet electroforming mathematical models,the growth morphology of deposited layer was simulated.The experiment of fixed-point jet electroforming of copper was carried out by using of nozzle with circular outlet.The results show that the copper deposited layer is round cake structure with thick middle and thin margin.This is mainly consistent with the fixed-point jet electroforming simulation results,which verifies the correctness of the model.The flow and electric fields in the fixed point jet electroforming were analyzed.It is found that high group region of flow field of jet electroforming has great influence on the electric field distribution.And the cathode surface electric field corresponding to the nozzle exit center position is strong.The farther the center is from,the weaker electric field is.This leads to the different deposition rate on the cathode surface.Finally,the growth morphology of copper deposits is affected.