基于热塑性热熔胶的主动拆卸结构设计方法

Design Methods of Active Disassembly Structure Based on Thermoplastic Hot Melt Adhesive

为改善电子产品拆卸性能,进一步丰富和完善主动拆卸理论,提高废弃电子电器产品回收率,有效回收电子废弃物中的各种金属、塑料等材料,实现电子电器产品在全生命周期末端的高效拆解以及材料的高值回收,提出热塑性热熔胶主动拆卸原理。通过遥控器的热熔胶主动拆卸试验,分析其电热激发、空气浴激发以及水浴激发的主动拆卸时间及影响因素,进而提出基于热塑性热熔胶的主动拆卸结构设计准则,最终提出基于热塑性热熔胶的主动拆卸结构设计方法。为实现电子电器产品在生命周期终端的一次性完全自动拆解,提出热塑性热熔胶产品分级主动拆卸方法,通过案例分析验证该设计方法的正确性。

In order to further enrich and perfect the active disassembly theory, improve disassembly performance and recovery rate of discarded electronic products and recycle effectively all kinds of metal, plastic materials from e-waste. To realize the efficient disassemble and high value recovery of material of at the end of the whole life cycle for electronic products, active disassembly theory based on thermoplastic hot melt adhesive is proposed. Through active disassembly experiment of remote control. Active disassembly time and influence factors are analyzed for its electric heat excitation, air bath excitation and water bath, and then design criteria is proposed. Methods are proposed finally. To achieve one-time fully automatic disassembly in the life cycle of the terminal for electronic products, Product multi-step active disassembly methods are proposed. Validity of design methods are verified by case analysis.