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K418B和FGH91双合金热等静压扩散连接的动力学模拟研究 被引量:2

Dynamic Simulations of Hot Iso-static Pressing Diffusion Bonding between K418B and FGH91
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摘要 采用DICTRA动力学软件和Thermo-Calc热力学软件对K418B铸造高温合金和FGH91镍基粉末高温合金进行热等静压扩散连接动力学模拟研究。主要进行两种不同的高温合金在热等静压扩散连接反应层中的元素互扩散规律模拟计算。利用热力学软件模拟确定两种合金在不同温度下的相分布情况,为成分的确定和温度的选取提供参考。在热力学相分析的基础上,利用动力学软件计算不同温度、不同时间扩散连接界面的元素分布情况,得到界面元素互扩散区宽度随时间和温度变化的增长规律,综合考虑过高温度和保温过长时间增加的设备负担,提出热等静压(Hot iso-static pressing,HIP)扩散连接的优化工艺范围,即连接温度为1 120~1 150℃、扩散时间为3~5 h是较合适的扩散连接工艺范围。 Element mutual diffusions between K418B and FGH91 during hot iso-static pressing(HIP) diffusion bonding are simulated by DICTRA and Thermo-Calc software. The inter-diffusion behaviors of the elements of two alloys after HIP are calculated. The distribution of phases formed under different temperatures in the alloys is thermodynamically simulated, which provide a sound theoretical evidence for the determination of composition and the selection of temperature. The joining processing of the two alloys with various temperatures and time is determined by dynamic simulation. By analyzing the changing of elements inter-diffusion distance with the changing of temperatures and time, and taking the huge cost of high temperature and long time into consideration, the proper diffusion time for HIP diffusion bonding is 3 to 5 hours and the proper diffusion temperature is 1 120-1 150 ℃.
出处 《机械工程学报》 EI CAS CSCD 北大核心 2013年第20期170-175,共6页 Journal of Mechanical Engineering
基金 国家自然科学基金资助项目(50974044)
关键词 K418B FGH91 热等静压扩散连接 动力学模拟 K418B FGH91 Hot iso-static pressing(HIP) Dynamic simulation
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