基于故障物理的电子产品可靠性仿真分析方法

Research on Reliability Simulation Prediction of Electronic Product Based on Physics of Failure Method

基于故障物理的电子产品可靠性仿真分析方法首先对产品进行故障模式、机理与影响分析(FMMEA),得到所有潜在故障点的故障模式、机理与对应的物理模型。利用产品材料、结构、工艺、应力等参数建立产品的仿真数字模型,并进行应力分析,利用概率故障物理(PPoF)模型进行损伤分析,得到各潜在故障的寿命分布。最后利用时间竞争的原理对其进行数据融合,得到产品故障率、平均故障间隔时间(MTBF)等可靠性指标。通过某型单板计算机的可靠性仿真过程说明了该方法的实施流程。这种基于故障物理的可靠性仿真的方法从微观角度将可靠性与产品的结构、材料及所承受的应力联系在一起,有助于发现产品的薄弱环节并采取切实有效的措施,是目前基于手册数据的可靠性预计方法的有益补充。

In PoF based reliability prediction method, FMMEA is firstly introduced to get the failure mode, mechanism and failure physics models. Performance parameters such as material, structure, tech- nology and stress are used to found the simulation model. Some data are acquired by stress analysis and then PPoF models are used to carry out damage analysis, from which a great amount of TI＇F samples un- der single point and single failure mechanism are achieved. Reliability parameters like failure rate and MTBF can be computed through fusing of 33＂F data. Reliability prediction of a single board computer is given as an example of the failure simulation method. This method links reliability with structure, materi- al and stress of a product, which will assist finding the weakest point of a product and adopting effective measures. This method is a supplement to statistics data based reliability prediction method.