关于超大规模集成电路制造中的应力迁移问题

The Problem About Stress Migration in the VLSI Manufacture

应力迁移是影响集成电路 ( IC)金属配线可靠性的缺陷之一。它缘起于绝缘膜与金属配线之间的热应力。本文概要介绍两种性质的绝缘膜产生的两种应力缺陷以及检测方式 ,并分类说明金属膜厚、线宽、温度等与应力的关系。简要说明应力迁移产生的可能机理及目前采取的几种对策。

The stress migration is one of defect that determines metal routing reliability in the IC manufacture. It is result to the difference of thermal stress between the insulator′s film and metal routing. This article sketchily introduces two type stress defect because of the two type character of the insulator′s film, and inspection ways. Classify to narrate the relation between the stress and metal film′s thickness, routing width, temperature etc. Sketchily narrate the possible mechanism of causing the stress migration and nowadays how to deal with these problems.