化学镀镍工艺对金刚石/铜复合材料表面镀层性能的影响

Effect of electroless nickel plating process on the properties of the plating layer on diamond/Cu composite materials

通过在金刚石/铜复合材料表面上化学镀镍的方法使表面金属化以改善其焊接性.研究了镀镍工艺对Ni-P合金镀层中磷含量的影响,以及不同磷含量对镀层的结合强度、耐蚀性和AgCu28钎料铺展性的影响,并对镀层的工艺与厚度进行了优化.AgCu28钎料在磷质量分数为5.8%～8.7%的镀层上均表现出较好的铺展性,且含磷8.7%的镀层比磷含量低的镀层的耐蚀性要好.综合考虑镀层与基体的结合强度和钎料在镀层上的铺展性,认为镀覆时间为10～20 min的镀层,即厚度为5～8μm时,镀层性能最理想.

Electroless nickel plating was used to improve the weldability of diamond/Cu composites. Experiments were performed to study the influence of nickel plating process on the phosphorous content of Ni-P alloy coatings as well as the effects of phosphorous content on the bond strength between the coatings and diamond/Cu substrates, the corrosion resistance of the coatings and the spreading area of AgCu28 filler on the coatings. Besides, the coating thickness and process were optimized. It is found that AgCu28 filler on the coatings with 5.8% to 8.7% phosphorus shows good spreadability, and the coating of 8.7% P has a better corrosion resistance than that with a lower P content. In comprehensive consideration with bond strength and filler spreadability on the coatings, the coating with 10 to 20 rain plating time, namely the thickness of 5 to 8 μm, is ideal.